Product Introduction:
The Keda Jinwei UV laser marking machine is developed using a 355nm UV laser. Compared with infrared laser, the machine adopts third-order intracavity frequency doubling technology. The 355 UV focused spot is very small, and the marking effect is to directly break the molecular chain of the material through short wavelength laser, greatly reducing the mechanical deformation and thermal deformation of the material (belonging to cold light). Because it is mainly used for ultra-fine marking and engraving, it is particularly suitable for industries such as food and pharmaceutical packaging material marking, micro hole drilling, high-speed division of glass materials, and complex graphic cutting of silicon wafers. Our company has developed advanced laser marking machines in collaboration with German and American laser companies using international advanced technology; UV laser is a type of laser that is pumped by a high-power multi-mode laser diode to produce a laser beam that is then doubled in frequency. The laser beam is automatically marked by controlling the deflection of a high-speed scanning mirror through a computer to change the optical path of the laser beam.
UV laser marking machine features:
●High beam quality, very small spot size, capable of achieving ultra-fine marking;
●Almost perfect marking quality: 355nm output wavelength reduces the thermal impact on the workpiece; Mirror type high-precision marking head, with fine marking effect and repeatable processing; High precision and detailed spot ensures the perfection of the marking results; The marking process is non-contact, and the marking effect is permanent;
●UV laser marking machine has a wide range of applications;
●The heat affected area is very small, there will be no thermal effect, and the material will not deform or burn;
●Fast marking speed and high efficiency;
●The whole machine has stable performance, small size, and low power consumption.
●More suitable for processing materials with high thermal radiation reactions; Can be coordinated with production lines, automatic loading and unloading, and automatic feeding and discharging; Suitable for marking on the vast majority of metal and non-metal materials;

●Silicon wafer micro hole and blind hole processing;


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